Wafer Cutting and Distribution System

  • Wafer cutting machines cut the wafer books discharged from the wafer block cooler to smaller wafer fingers in the desired size.
  • Single and double cutter version.
  • Block turner device for longitudinal wafer block feeding in case of any need.
  • Automatic infeed unit at the entrance of the machine.
  • Clear-cuts by means of stainless stell cutting knives fixed on the exchangeable stainless cutting frames.
  • Capacity up to 14 blocks/minute for single-cutter version
  • The total waste ratio after the cutting operation is maximum % 5 of the blocks. This is aprox 5 mm from each side of the block. (This depends on the final cutting dimensions of the product.)

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